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Nano Material Research

         I began this project after discussing the research of a fellow graduate student at a conference in 2019. I found the topic intriguing and realized that there was potential for collaboration. It investigates the piezoelectric response of nano-scale laminated wafers. My contribution was to do an FEA analysis of the wafers undergoing a heat treatment process with a maximum temperature of 800 degrees Celsius. Simulations were performed in Solidworks and ANSYS (only Solidworks results are shown here).

        Wafer configuration

        Wafer configuration in SolidWorks

        Initial displacement results.

        Updated displacement plot.

        A combined graph of two coinciding edge plots.

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