I began this project after discussing the research of a fellow graduate student at a conference in 2019. I found the topic intriguing and realized that there was potential for collaboration. It investigates the piezoelectric response of nano-scale laminated wafers. My contribution was to do an FEA analysis of the wafers undergoing a heat treatment process with a maximum temperature of 800 degrees Celsius. Simulations were performed in Solidworks and ANSYS (only Solidworks results are shown here).